Photofabrication Engineering Inc. (www.pei.com; PEI) is offering photochemically etched surface-mount and insert-mount lead frames for microchip packaging through a process that is 90% faster than traditional tooling methods.

PEI says it can produce lead frames with thicknesses between 0.0127 mm and 1.575 mm, containing features as small as 0.10 mm on 0.254-mm centers. The company notes it can etch single- or double-sided lead frames with tighter tolerances and greater intricacies than can be achieved through stamping.

Frame materials include copper alloys, kovar, nickel-iron alloys, and pure nickel. Additionally, lead-free plating including silver, nickel, gold, or tin is available. Frames can be produced as prototypes or at production scale and are suitable for semiconductors, glass-to-metal seals and relays.